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Saniwave Technology Co., Ltd.
Website: www.saniwaveltd.com
Tel: +86-755-89216755
Fax: +86-755-89264521
E-mail:  info@saniwaveltd.com
Address: 601, Building T, Hengyu Science 
and Technology Park, No.1 Ruiji Road, 
Longgang District, Shenzhen, China

Silicon Wafer Polishing Pads
 Product >> Silicon Wafer Polishing Pads >> All categories
 
Number：
 CMP08
Name：
 CMP Polishing Pad
Specifications：
 1.37X600MM
Remarks：
Category：
 Silicon Wafer Polishing Pads
 
   Product description
Mode#: CMP08
CMP Polishing Pad
Thickness: 1.4mm or bespoke thickness
Compression ratio: 16.7%
Density: 0.37g/cm3
Hardness(JIS-A): 65
Size: bespoke size, diameter up to 1.4 meters.
Usage: fine polishing for silicon wafers, gemstones, glass, metals, ceramics, etc.
Click：16  Time：2024-08-05 【Print】 【Close】
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